¡@

¡@

We take pleasure to invite you to participate the "2005 International Conference on Asian Green Electronics - Design for Manufacturability and Reliability (2005 AGEC)" on 15-18 March 2005 in Shanghai New International Expo Centre SNIEC, Pudong, Shanghai, China. The purpose of the conference is to present the latest advancements in environmentally compatible electronics design, manufacturing and packaging technology. The goal is to help electronics companies design and manufacture green electronics products for the global market.

¡@

Sponsor By:

¡@

          

¡@

¡@

¡@

NEW & EVENT!!

¡@

2005AGEC Conference Programme

¡@

Business Tour at PHILIPS

¡@

Tutorial 1:  Determining Reliability of Lead-Free Assemblies

by Dr. Christopher Hunt, NPL Laboratory, UK

¡@

Tutorial 2:  Tin Whiskers, Electromigration and Interfacial Reactions in Pb-free Electronic Packaging

by Dr. M.O. Alam, City University of Hong Kong, HK China

¡@

Tutorial 3:  Meeting Green Design Requirements for the European Market

by Dipl.-Ing Hansjoerg Griese, Dr. Jutta Mueller, Dipl.-Ing. Karsten Schischke, IZM, Germany

¡@

Shuttle Bus Reservation Form & Schedule

¡@

electronica & ProductronicaChina 2005 Exhibition

¡@

2005 AGEC Paper Submission

¡@

Final Programme

File Size: (18.6MB)

¡@

¡@

¡@

¡@