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Abstracts and Papers
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Important
Dates
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November 30,2004
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Full
Paper Due
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You are
cordially invited to submit papers to the 2005 International Conference
on Asian Green Electronics - Design for Manufacturability and
Reliability (2005 AGEC). The conference will be held in Shanghai,
China in line with electronica China 2005 and Productronica China
2005 Exhibition.
The purpose
of the conference is to present the latest advancements in environmentally
compatible electronics design, manufacturing and packaging technology.
The goal is to help electronics companies design and manufacture
green electronics products for the global market.
Papers
are now invited from other industry participants as well as researchers
from academic and government organizations on the following topics:
- Design for green
electronics
- Green manufacturing
technologies including lead-free solders, conductive adhesives
and other green technologies
- Halogen free substrates
- Environmentally
Friendly Packaging and Design Technologies
- Life Cycle Analysis
and Assessment
- Life Cycle Cost
Analysis
- Life Cycle Data
Management
An
electronic form of a one-page, 300 word abstract with name, address,
phone and fax numbers, and email address must be submitted to
the technical committee by email at wywong@ee.cityu.edu.hk.
Instructions for preparing the full paper will be sent to authors
whose abstracts are accepted after review. Accepted papers will
be published in a formal IEEE Conference Proceedings with an ISBN
number. Participants will be required to register for the conference
upon notification of acceptance of their full papers.
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