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¡@ 15 March 2005 (Tuesday) Tutorial 1: Determining Reliability of Lead-Free Assemblies Tutorial 3: Meeting Green Design Requirements for the European Market ¡@ ¡@ 15 March 2005, 9.30am - 12.30pm  (Room: W3M4, Wing: 3) ¡@ Tutorial 1:Determining Reliability of lead-free Assembliesby Dr. Christopher Hunt Two aspects dominate the implementation of lead-free from a quality aspect. This is the lifetime service integrity of the solder joint, and the insulation properties of the processed printed circuit board. The reliability work at NPL will be presented that is leading to a better understanding of what the differences are with tin-lead and what the changes in reliability will be. A number of different alloys have been studied, along with different board finishes. These studies have been supplemented by modelling to extend the application of the work. Process residues form the lead-free processes are potentially more problematic and NPL have been looking at this along with the test methods used to identify process residues. Finally circuit board properties are investigated, looking specifically at conductive anodic filamentation, and how potentially this is more a more severe problem with lead-free and increased miniaturisation. Speaker Biography ¡@ Dr Christopher Hunt is the group leader for the Electronics Interconnection Group at NPL, supported by industry and the UK government. The work focuses on process issues impacting on the industry. He has direct responsibility for work on soldering issues in the electronics assembly area, which include, reliability, stencil printing, solderability, degradation of encapsulants and cleanliness issues. He was part of the team that authored the UK Lead-Free Report, and was part of the DTI funded technology mission that visited Japan in 2001 to assess lead-free soldering. He sits on an IEC committee concerned with solderability and the ISO committee concerned with fluxes and SIR testing. Dr Hunt also regularly attends IPC meetings, particularly J-Std 002 and 003, as well as committees looking at SIR testing. He successfully led a European collaborative project looking at SIR testing. In total Chris has lead more than 20 research projects at the NPL. Dr Hunt has published over 20 papers in the scientific literature, with over 60 NPL reports. He has presented at numerous UK and international conferences and workshops.
Academic and professional qualifications Honours degree (1st) in Physics and a PhD from Surrey University in Materials Science, and a member of Institute of Physics. ¡@
¡@ (Room: W2M3, Wing: 2) ¡@ Tutorial 2:Tin Whiskers, Electromigration and Interfacial Reactions in Pb-free Electronic Packaging¡@ by Dr. M.O. Alam
Abstract ¡@ The urgent demand for environmentally-friendly or ¡§green¡¨ materials for electronics manufacturing, such as Pb-free surface finish/solders, is now critical in the global electronics market. Added to this is the desire to make electronics products more portable. These two requirements, ¡§green electronics¡¨ and ¡§product portability¡¨, have raised many fundamental scientific and engineering issues that must be addressed in the longer term.
Pb-free surface finishes such as pure Sn or Sn(Cu) on the lead frame and fine-pitch traces are prone to be failed because of Sn-whiskers. On the other hand, several failure modes has been reported in the tiny solder joints when current density is slightly higher. Because of a higher reflow temperature and a higher Sn concentration, the reaction between Pb-free solders and thin film metallization during reflow cycles as well as during the service life is more severe than that in Sn-Pb solder. Therefore, there is a higher reliability risk that a thin solderable layer will be dissolved out quickly or too large a fraction of solder joints will transform into brittle IMCs. Thus, it is crucial for an electronic packaging engineer to know the related phenomenon/failure mode arising from the Pb-free solder/surface finishes in the electronic products. ¡@ In this short course, we will briefly discuss about the morphology and growth of Sn whisker, the driving force of electromigration and associated damage mechanics at the solder interface along with the complex interfacial reactions in Pb-free solder joints. ¡@ Speaker Biography¡@ ¡@ Dr. M. O. Alam has received his B.Sc. Eng. and M. Sc. Eng. from the Bangladesh University of Engineering and Technology (BUET), Dhaka, Bangladesh in 1995 and 1997 respectively. He joined in the same University as a lecturer and promoted to be an Assistant Professor in 1999. He has been working in EPA Centre, City University of Hong Kong for last 4 years. He received his Ph. D. in 2004 in the area of electronic packaging from the City University of Hong Kong under Professor Y. C. Chan and a collaborative research program with a Hong Kong-based flexible substrate manufacturing industry. ¡@ Dr. Alam has published more than 30 journal and conference papers in the area of electronic packaging and materials engineering. His research interest includes electronic packaging & failure analysis, Pb-free solder, tin whiskers and electromigration. ¡@ ¡@
¡@ (Room W3M4, Wing 3)
Tutorial 3: Meeting Green Design Requirements for the European Market by Dipl.-Ing Otmar Deubzer, Dr. Jutta Mueller, Dipl.-Ing. Karsten Schischke A major part of the supply chain for electronics products sold on the European market is located in China. Hence, Chinese companies have to comply with European legislation, such as material bans and design requirements, if they will serve the European market successfully also in the near future. Even more, eco-friendly design will not be a marketing issue solely, but also a matter of legal compliance mid-term. As European legislation is complex this tutorial will explain the basics and will give interpretation of critical aspects. In addition, preparing for eco-design now means being one step ahead of the market. Appropriate strategies and successful case studies will be presented. The tutorial will comprise the following topics: 1. Introduction on EU legislation and policy ¡P Relevancy and requirements of the directives WEEE (directive on waste from electrical and electronic equipment), RoHS (directive on restriction of use of certain hazardous substances in electrical and electronic equipment) ¡P Status of national implementation of WEEE and RoHS ¡P WEEE and RoHS details, which are still on a level of clarification on EU level ¡P latest status of EuP (directive on establishing a framework for eco-design of energy-using products) draft directive ¡P IPP (Integrated Product Policy) framework ¡P Other directives and policies, such as REACH (Registration, Evaluation and Authorisation of Chemicals), ELV (end of life vehicles directive) ¡P Linkages and synergies of the different policies and directives
2. Basics in Eco-Design ¡P Methodologies and tools ¡P Ecologic product profiles, material declarations, supply chain management ¡P International standards, such as ISO 14.040 and 14.062 ¡P Conjunction with Life Cycle Analysis and environmental management systems ¡P Strategies to implement eco-design ¡P hort case studies ¡@ Speaker Biography ¡@ Dipl.-Ing. Otmar Deubzer Otmar Deubzer studied Medicine in Erlangen in Germany and graduated from TU Berlin with Environmental Engineering. His main subjects are Water Management, Environmental Engineering, Microbiology, LCA and Waste Management. He started his career at the Fraunhofer IZM and TU Berlin from 1996 to 1999. From 1999 to 2001 he worked at the University of Tokyo in Japan on environmental engineering and EcoDesign in the electronics industry, before he came back to Fraunhofer IZM and TU Berlin in 2001. He is Chief Coordinator of EcoDesign issues across the departments of the Fraunhofer IZM and TU Berlin. His research focuses on environmental/sustainability issues around interconnection technologies in electronics with a focus on lead-free soldering and on the environmental and technological effects of the RoHS and WEEE legislation on the electronics industry. Since 2002, Otmar Deubzer is the General Manager of the European part of the international IMS-project EFSOT (Next Generation Environment Friendly Soldering Technology) where European, Japanese and Korean industry and university partners jointly work on technological and environmental issues in lead-free soldering. Dr. Jutta Müller
Dipl.-Ing. Karsten Schischke
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