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Semi-Automatic Flip Chip Bonder

Manufacturer Toray Engineering Co., Ltd FC2000
Model FC2000
Application Flip Chip Bonding, Fine-Pitch Component Bonding

Main Specification

Substrate Dimensions (L x W) 50 x30 (mm) to 120 x 120 (mm)
Substrate Material Glass epoxy/FPC/Ceramic, etc.
Chip Dimensions (L x W x t) 3.0 x 3.0 x 0.3 (mm) to 20 x 20 x 1.0 (mm)
Number of Chip Types 1 to 4
Chip Supply Direction Face down
Cycle Time 40 sec/chip
Alignment Accuracy (3 sigma) (X,Y) ±2µm; ±3σ
Heated Tool Temperature RT to 450°C Ceramic heater
Bonding Pressure Force Low pressure: 0.49 to 14.7 (N)
High pressure: 14.7 to 294 (N)
Air Pressure Source Dry air 0.49 Mpa (5kg/cm2)
Vacuum Source -80 Kpa