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"What You Must Do To Get Ready For RoHS?"

The electrical and electronic products that we use everyday have now been identified as a major source of toxic waste at the end of their product life. Many chemical substances added to the materials to enhance product functionality have been proven to be dangerous to the environment and human health and safety when the products are disposed of at the end of their product life. To minimize the environmental impact from the "e-waste", China and the EU member states have now introduced new legislation, known as RoHS, which will both ban the use of lead and some other substances in electrical and electronic products.

Due to this regulatory requirement, an expedient transition to lead-free electronics has become necessary for most electronics industry sectors. The consequences of not meeting the 1 July 2006 deadline for transition to lead-free electronic products may translate into global market losses.

Considering that lead-based electronics have been in use for over 40 years, the adoption of lead-free technology represents a dramatic change. In less than 10 years, the industry is being asked to adopt different electronic soldering materials, and surface finishes for both components and printed circuit boards. This challenge is accompanied by the need to re-qualify component-board assembly and rework processes, as well as test, inspection and documentation procedures. In addition, lead-free technology is associated with increased materials, design and manufacturing costs. The use of lead-free materials and processes has also prompted new reliability concerns, as a result of different alloy metallurgies and higher assembly process temperature relative to tin-lead soldering.

Course Content

  • RoHS and relevant restricted substances regulations
  • RoHS substances, testing & solution
  • Overview what is needed for equipment manufacturers to efficiently
  • implement a lead-free transition process that accounts for:
    • The company share
    • Associated exemptions
    • Technological feasibility
    • Product reliability requiremetns and cost
  • Guidelines for companies interested in migrating to lead-free products, who will purchase lead-free parts or subassemblies, adn who will support traditional products, are also discussed

Speaker Biographical Sketch

Mr Jimmy Chen has a Master degree in Business Administration from the San Francisco State University. Since graduated in 1988, he has been working in the Taiwan electronic industry in sales and marketing functions. Jimmy joined the Intertek group in mid-2002 and is now the Asia Pacific Business Development Director of the Labtest Division of the Intertek group. Intertek is a leading international testing, inspection, certification, training and advisory organization, which assesses products and commodities against a wide range of safety, regulatory, quality and performance standards. Intertek has over 280 laboratories with more than 12,900 people around the world and is a recognized leader in supply chain RoHS compliance management services.

Professor Michael Pecht has a BS in Acoustics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is the founder and the Director of the CALCE Electronic Products and Systems Center at the University of Maryland and a Chair Professor. He is a Professional Engineer, an IEEE Fellow and an ASME Fellow. He has received the 3M Research Award, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions. He has written eighteen books on electronic products development, use and supply chain management. He has also edited a series of books on the Asian electronics industry including a recent book titled "The Chinese Electronics Industry – 2004 edition". He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology. He has consulted for over 50 major international electronics companies, providing expertise in strategic planning, design, test, IP and risk assessment of electronic products and systems.

Date: 29 April 2005 (Friday)
Time: 11.00am - 12.30pm
Venue: LT-1, City University of Hong Kong,
83 Tat Chee Avenue, Kowloon Tong,
Hong Kong
Language: English

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