The rapid growth in wireless, portable, and multi-functional devices has enhanced the development of electronic packaging technology. There is a greater demand of flip chip assembly in advanced packaging, especially the use of Pb-free solder joints. European Union Congress has a ban on Pb-based solders in consumer electronic products on July 1st, 2006. The reliability of Pb-free solder joins is of concern in manufacturing industry. For example, the reflow of Pb-free solder paste produces many more residue voids than SnPb solder paste. This one-day course will start from the trend in electronic packaging technology. It will be followed by the analysis of solder reactions in wetting and in solid state aging. The unique reliability behavior of spalling of intermetallic compounds in thin film under-bump-metallization and the formation of Kirkendall voids in thick under-bump-metallization will be discussed. Next, electromigration induced failure in flip chip solder joints will be analyzed. The unique failure mode of electromigration in flip chip solder joints will be explained on the basis of current crowding. Joule heating that leads to melting of flip chip solder joints will be discussed. Thermomigration in solder joints will be covered. Then, mechanism and prevention of spontaneous Sn whisker growth on Pb-free finish will be presented. Spontaneous Sn whisker growth is an irreversible process, in which there are two atomic fluxes driven by two driving forces. We must decouple the two driving forces or the two atomic fluxes in order to prevent Sn whisker growth. Due to accidental and frequent drops of portable devices to the ground, impact test has recently received much attention from the point of view of reliability of handheld and portable devices A mini impact test machine which has been built to detect the ductile-to-brittle transition in ball-grid-array solder joints will be described. Finally, the trend of miniaturization and the prospect of using nano structured materials in future electronic packaging technology will be discussed.
Professor King-Ning Tu received his Ph. D. degree in Applied Physics from Harvard University in 1968. He spent 25 years at IBM T. J. Watson Research Center as Research Staff Member in Physical Science Department. During that period, he also served as Senior Manager of Thin Film Science Department and Materials Science Department for 10 years. In September 1993, he joined the Dept. of Materials Science and Engineering at UCLA as full professor. He was chairman of the Department for six years from 1998 to 2004. He is a Fellow of American Physical Society, The Metallurgical Society (TMS), and an Overseas Fellow of Churchill College, Cambridge University, UK. He was president of Materials Research Society in 1981. He received the Application to Practice Award from TMS in 1988, and Humboldt Award for US Senior Scientists in 1996. He has been elected a member of Academia Sinica, Republic of China in 2002. He has over 350 journal publications, edited 13 proceedings, and co-authored a textbook on "Electronic thin Film Science," published by Macmillan in 1992. His research interests are in metal-silicon reactions, solder reactions, nanoscale reactions, polarity effect of electromigration on interfacial reactions, and kinetic theories of interfacial reactions. His website is http://www.seas.ucla.edu/eThinFilm.
|Date:||3 January 2006 (Tuesday)|
|Time:||9:00pm – 5:30pm|
|Venue:||Rm G6302, 6/F, Lift 7, Academic Bldg, City University of Hong Kong,
83 Tat Chee Avenue, Kowloon Tong, Kowloon,