Electronics has been and continues to be one of the largest global industries with $1.4 T market value. It has been the driving engine for science, engineering and manufacturing, leading to the global prosperity in those parts of the world that invested and participated in it. The first electronics wave, which started with the invention of the transistor, has been largely due to Moore's Law, based on CMOS, or the First Law of Electronics, and the associated hybrid and discrete component-based approach to system integration using 100s of discrete components made of ceramics, organics, silicon, metals, solders and alloys. This CMOS-based era is beginning to pose major barriers beyond 22 nm due to design complexity, minimal performance gain and escalating wafer costs A new era has begun to emerge, the focus of which is on 3D ICs instead of monolithic integration of heterogeneous functions. While the impact of this approach is profound, it addresses a small pat of the system. What is necessary is another paradigm shift to 3D Systems leading to unparalleled miniaturization, functionality and cost at system level. This is the focus of this presentation with 3D System-on-Package concept with nanoscale components for actives, passives, thermal interfaces, and System interconnections and batteries at micro and nano-scales.
Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision, since 1994. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging based on 35-layer alumina and 61-layer LTCC with copper and copper-polymer thin film, and materials for ink-jet printing and magnetic storage. He received many industry, academic and professional society awards including Industry Week's award for improving U.S. competitiveness, IEEE's David Sarnoff, Major Education and Sustained Technical awards, Dan Hughes award from IMAPS, Engineering Materials Achievement award from DVM and ASM-International, Total Excellence in Manufacturing award from SME, John Jeppson's award from the American Ceramic Society as well as the Distinguished Alumni Awards from the University of Illinois, the Indian Institute of Science, Bangalore and Georgia Tech. He received BS from IISc, Bangalore and Ph.D. from the University of Illinois. Prof. Tummala published 426 technical papers, holds 74 patents and inventions; authored the first modern packaging reference book—Microelectronics Packaging Handbook (Van Nostrand, 1988) and the first undergrad textbook—Fundamentals of Microsystems Packaging (McGraw Hill, 2001) and first book introducing the System-On-Package technology. He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and member of the National Academy of Engineering in USA and in India. He was the President of both IEEE-CPMT and the IMAPS Societies.
|Date:||8 December 2009 (Tuesday)|
|Time:||2:30pm – 3:30pm|
|Venue:||B6605, 6/F, Academic Bldg, City University of Hong Kong,
83 Tat Chee Avenue, Kowloon Tong, Kowloon,
For seat reservation, please fax the Registration Form to (852)-2788 7579 on / before 8 December 2009.