Prof. Y. C. CHAN
PhD (Imperial College London), FIEEE, DIC, MSc (Eng), BSc (Eng), ACGI, CEng, FIET, FHKIE
PRESENT POSITION
Director, EPA centre*
Chair Professor, Department of Electronic Engineering, City University of Hong Kong
* Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering
RESEARCH EXPERTISE
Electronic Product Reliability and Electronic Packaging, Failure Analysis and Reliability Engineering
PUBLICATIONS SUMMARY:
230 papers in international refereed journals, 100 conference papers and 4 Books. Total ISI citations: 2400+; H-index: 29
PUBLICATIONS HOMEPAGE:
http://www.ee.cityu.edu.hk/~epa/publications-ycchan/PeerJournals-1.htm
REPRESENTATIVE PUBLICATIONS:
1. Y.C. Chan, D. Yang, “Failure mechanisms of solder interconnect under current stressing in advanced electronic packages”, Progress in Material Science, 55 (2010), 428-475.
2. X. Gu and Y.C. Chan, “Thermomigration and electromigration in Sn58Bi solder joints”, Journal of Applied Physics, 105 (2009) 093537[1-5].
3. A.K. Gain, Y.C. Chan, A Sharif, Winco K.C. Yung, “Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages”, Microelectronic Engineering, 86(11) (2009) 2347-2353.
4. D. Yang, Y.C. Chan and K.N. Tu, “The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing”, Applied Physics Letters, 93 (2008) 041907.
5. D. Yang, B.Y. Wu, Y.C. Chan, and K.N. Tu, “Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints”, Journal of Applied Physics, 102 (2007) 043502.
6. M.O. Alam, B.Y. Wu, Y.C. Chan and K.N. Tu “High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints”, Acta Materialia, 54 (2006) 613.
7. B.Y. Wu, M.O. Alam, Y.C. Chan and H.W. Zhong, “Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing”, Journal of Electronic Materials, 37 (2008) 469.
8. M.O. Alam and Y.C. Chan “Solid state growth kinetics of Ni3Sn4 at the Sn-3.5Ag solder/Ni interface”, Journal of Applied Physics, 98 (2005) 12352.
9. B.Y. Wu , Y.C. Chan, “Electric current effect on microstructure of ball grid array solder joint”, Journal of Alloys and Compounds, 392 (2005): 237-246.
10. M.N. Islam, Y.C. Chan, A. Sharif, “Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages”, Journal of Materials Research, 19(10) (2004): 2897-2904.
COURSES I AM TEACHING: