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Peer-reviewed Journal Publications
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No. |
Title |
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203 |
¡§Investigation of Small Sn-3.5Ag-0.5Cu Additions on
the Microstructure and Properties of Sn¡V8Zn-3Bi Solder on Au/Ni/Cu pads¡¨,
Asit Kumar Gain, Tama Fouzder, Y.C. Chan, Ahmed Sharif, Winco
K.C. Yung, Journal of Alloys and Compounds, 489(2), Pages 678-684 (Jan 2010) |
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204 |
¡§Study of the Dispersion and Electrical Properties
of Carbon Nanotubes Treated by Surfactants in Dimethylacetamide¡¨, Q. Y. Tang, I. Shafiq, Y. C. Chan, N.
B. Wong, and R. Cheung, Journal
of Nanoscience and Nanotechnology, 10, 4967-4974 (Jan 2010) |
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205 |
¡§An experimental methodology for the study of
co-planarity variation effects in anisotropic conductive adhesive
assemblies¡¨, G. Dou, D.C. Whalley, C. Liu, Y.C.
Chan, Soldering and Surface Mount Technology, 22 (1), Pages 47-55. (Jan 2010) |
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206 |
¡§Failure mechanisms of solder interconnect under current
stressing in advanced electronic packages¡¨, Y. C. Chan, D. Yang, Progress in
Material Science, Volume 55, Issue 5,
Pages 428-475 (July 2010) |
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207 |
¡§Influence of Ag micro-particle additions on the
microstructure, hardness and tensile properties of Sn-9Zn binary eutectic
solder alloy¡¨, M. Ahmed, T. Fouzder, A. Sharif, A.K. Gain, Y.C. Chan,
Microelectronics Reliability, Volume 50, Issue 8, Pages 1134-1141(Aug 2010) |
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208 |
¡§Effect of nano Al2O3 additions on the
microstructure, hardness and shear strength of eutectic Sn-9Zn solder on
Au/Ni metallized Cu pads¡¨, Tama Fouzder, Asit Kumar
Gain, Y.C. Chan, Ahmed Sharif, Winco K.C.
Yung, Microelectronics
Reliability, Volume 50, Issue 12, Pages 2051-2058 (Aug 2010) |
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209 |
¡§Surfactant-assisted processing of polyimide/multiwall
carbon nanotube nanocomposites for microelectronic applications¡¨, Qing-Yuan
Tang, Y. C. Chan, N. B. Wong and R. Cheung, Polymer International, Volume 59,
Issue 9, Pages 1240-1245 (Sept 2010) |
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210 |
¡§The influence of addition of Al nano-particles on the
microstructure and shear strength of eutectic Sn-Ag-Cu
solder on Au/Ni metallized Cu pads¡¨, Asit Kumar
Gain, Tama Fouzder, Y.C. Chan, A. Sharif, N. B. Wong, Winco
K.C. Yung , Journal of Alloys and Compounds, Volume 506, Issue 1, Pages
216-223 (Sept 2010) |
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211 |
¡§Effect of carbon nanotubes
and their dispersion on thermal curing of polyimide precursors¡¨, Qing-Yuan
Tang, Jie Chen, Y.C. Chan, C.Y. Chung, Polymer Degradation
and Stability, Volume 95, Issue 9, Pages 1672-1678 (Sept 2010) |
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212 |
¡§Thermomigration and electromigration
in Sn58Bi ball grid array solder joints¡¨, Xin Gu, K.C. Yung and Y.C. Chan, Journal of Materials
Science: Materials in Electronics, Volume 21, Issue 10, Pages 1090-1098 (Oct
2010) |
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