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Peer-reviewed Journal Publications
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No. |
Title |
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213 |
¡§Influence of SrTiO3 nano-particles on the
microstructure and shear strength of Sn-Ag-Cu
solder on Au/Ni metallized Cu pads¡¨ Tama Fouzder,
Ismathullakhan Shafiq, Y.C. Chan, A. Sharif and Winco
K.C. Yung, Journal of Alloys and Compounds, Volume 509, Issue 5, Pages
1885-1892 (Jan 2011) |
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214 |
¡§Microstructure, kinetic analysis and hardness of
Sn-Ag-Cu-1wt% nano-ZrO2 composite solder on OSP-Cu pads¡¨, Asit Kumar Gain,
Tama Fouzder, Y.C. Chan, Winco K.C. Yung, Journal
of Alloys and Compounds, Volume 509, Issue 7, Pages 3319-3325 (Jan 2011) |
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215 |
¡§Thermomigration and electromigration
in Sn8Zn3Bi solder joints¡¨, Xin Gu,
K.C. Yung, Y.C. Chan, D. Yang, Journal of materials science: Materials in
electronics, Volume 22, Issue 3, Pages 217-222 (Feb 2011) |
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216 |
¡§Fast response resistive humidity sensitivity of polyimide/multiwall
carbon nanotube composite films¡¨, Qing-Yuan Tang, Y.C. Chan, Kaili Zhang,
Sensors and Actuators, B: Chemical, Volume 152, Issue 1, Pages 99¡V106 (Feb
2011) |
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217 |
¡§Microstructure, thermal analysis and hardness of a
Sn-Ag-Cu-1wt% nano-TiO2 composite solder on flexible ball grid array
substrates¡¨, Asit Kumar Gain, Y.C. Chan, Winco K.C.
Yung, Microelectronics Reliability, Volume 51, Issue 5, Pages 975¡V984 (May
2011) |
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218 |
¡§Efficient field emission and optical properties of
In-doped cadmium sulphide nanopens
and nanopencils¡¨, Ismathullakhan Shafiq and Yan-Cheong
Chan, Micro Nano Letters, Volume 6, Issue 8, Pages 732-736 (Aug 2011) |
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219 |
¡§Effect of additions of ZrO2 nano-particles on the
microstructure and shear strength of Sn-Ag-Cu
solder on Au/Ni metallized Cu pads¡¨, Asit Kumar
Gain, Y.C. Chan, Winco K.C. Yung, Microelectronics
Reliability, Volume 51, Issue 12, Pages 2306-2313 (Dec 2011). |
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