Peer-reviewed Journal Publications

　

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No.	Title	Download
46	“Effect of negative rf bias on electrophotographic properties of hard diamond-like carbon films deposited on organic photoconductors”, X.M. He, S.T. Lee, Y.C. Chan, L. Shu and X.S. Miao, Journal of Phys: Condens. Matter 10, 7835-7841, September 1998.
47	“Effects of Bandwidth Limitations on the Localised State Distribution Calculated from Transient Photoconductivity Data”, D.P. Webb, C. Main, S. Reynolds, Y.C. Chan, Y.W. Lam and S.K. O’Leary, Journal of Applied Physics, Vol. 83, pp. 4782-4787, May 1998.
48	“Diffusion and Intermetallics Formation Between Pd/Ag Metalization and Sn/Pb/Ag Solder in Surface Mount Solder Joints”, G.Y. Li and Y.C. Chan, Materials Science and Engineering B: Solid State Materials for Advanced Technology, Vol. 57, pp. 116-126, January 1999.
49	“Carrier transport in thin films of organic electroluminescent materials” Z.B.  Deng, S. T. Lee, D. P. Webb, Y.C. Chan, W. A. Gambling, Synthetic Metals, Vol. 107, pp. 107-109, November 1999.
50	“Digital Speckle Correlation Method based on Wavelet-Packet Noise Reduction Processing”, X. Dai, Y.C. Chan and Alex C.K. So, Applied Optics, Vol. 38, No. 16, pp.3474-3482, June 1999.
51	“Optical Characterization of Hydrogenated Amorphous Silicon Thin Films Deposited at High Rate” S. H. Lin, Y.C. Chan, D. P. Webb and Y. W. Lam, Journal of Electronic Materials, Vol 28. ISS.12, pp1452-1456, December 1999.
52	“Evidence for photo-induced de-hydrogenation of defects in undoped a-Si:H using positron annihilation spectroscopy” X. Zou, Y.C. Chan, D. P. Webb, Y. W. Lam, Y. F. Hu, C. D. Beling, S. Fung and H. M. Weng, Physical Review Letters, Vol. 84, No. 4, pp. 769-772, January 2000.
53	“Nondestructive Defect Detection in Multilayer Ceramic Capacitors Using an Improved Digital Speckle Correlation Method with Wavelet Packet Noise Reduction Processing”, Y.C. Chan, K. C. Hung and X. Dai, IEEE Transactions on Components, Packaging and Manufacturing Technology: Advanced Packaging, Vol. 23, No. 1, pp. 80-87, February 2000.
54	“Gap States and Stability of Rapidly Deposited Hydrogenated Amorphous Silicon Films” S. H. Lin, Y.C. Chan, D. P. Webb and Y. W. Lam. Materials Science and Engineering B, Vol. B72 (2-3), pp 197-199, March 2000.
55	“Improved time-of-flight technique for measuring carrier mobility in thin films of organic electroluminencent materials”, B. J. Chen, C. S. Lee, S. T. Lee, D. P. Webb, Y.C. Chan, W. A. Gambling, H. Tian and W. H. Zhu, Japanese Journal of Applied Physics, Vol. 139, No. 3A, pp. 1190-1192, March 2000.
56	“Nondestructive Evaluation of Ceramic Substrate with Embedded Passive Components by SAM”, Z.Q. Yu, Y.C. Chan, D.P. Webb and G.Y. Li,  Journal of Electronic Packaging, Vol. 122, Iss. 2, pp. 172-177, June 2000.
57	“Effect of Pinhole Au/Ni/Cu Substrate on Self-alignment of Advanced Packages”, K.C. Hung, Y.C. Chan, H.C. Ong, P.L. Tu, and C.W. Tang, Materials Science & Engineering B, Vol. 76, No. 2, pp. 87-94, July 2000.
58	“Impact Properties of PBGA Assemblies Reflowed in Nitrogen Ambient and Compressed Air”, Y. P. Wu and Y.C. Chan, IEEE Transactions on Advanced Packaging, Vol. 23, No. 3, pp. 421-425, August 2000.
59	“Microstructural evolution of a mechanical alloyed Sn-Bi-Ag-Cu lead free solder under thermal shock and aging”, M.L. Huang, C.M.L. Wu, J.K.L. Lai and Y.C. Chan, Journal of Electronic Materials, Vol. 29, No. 8, pp. 1021-1026, August 2000.
60	“Developing a lead free solder alloy Sn-Bi-Ag-Cu by mechanical alloying”, C.M.L. Wu, M.L. Huang, J.K.L. Lai and Y.C. Chan, Journal of Electronic Materials, Vol. 29, No. 8, pp. 1015-1020, August 2000.
61	“Electronic Structures of Polycrystalline ZnO Thin Films Probed by Electron Energy Loss Spectroscopy”, H.C. Ong, J.Y. Dai, K.C. Hung, Y.C. Chan, R.P.H. Chang, and S.T. Ho, Applied Physics Letters, Vol. 77, No. 10, pp. 1484-1486, Sep. 2000.
62	“Investigation of mis-estimation of structure of amorphous silicon films in elliposometric modeling”, S.H. Lin,; Y.C. Chan.; D.P. Webb, Y.W. Lam, Journal of Non-Crystalline Solids, Vol. 276, pp. 35-39, Oct. 2000.
63	“Study of Ni3P Growth due to Solder Reaction-Assisted Crystallization of Electroless Ni-P Metallization”, K.C. Hung, and Y.C. Chan, Journal of Materials Science Letters, Vol. 19, No19, pp. 1755-1757, Oct. 2000.
64	“Correlation between Ni3Sn4 intermetallics and Ni3P due to solder reaction-assisted crystallization of electroless Ni-P metallization in advanced packages”, K.C. Hung, Y.C. Chan, C.W. Tang and H.C. Ong, Journal of Materials Research, Vol. 15, No. 11, pp. 2534-2539, Nov.  2000.
65	“Metallurgical Reaction and Mechanical Strength of Electroless Ni-P Solder Joints for Advanced Packaging Applications”, K.C. Hung, Y.C. Chan, and C.W. Tang, Journal of Materials Science: Materials in Electronics, Vol. 11, pp. 587-593,  Nov. 2000.
66	“Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock”, N.M. Poon, C.M.L. Wu, J.K.L. Lai, Y.C. Chan, IEEE Transactions on Advanced Packaging, Vol. 23, No. 4, pp. 708-714, Nov. 2000.
67	“Study of Self-Alignment of mBGA Packages”, K.C. Hung, Y.C. Chan, P.L. Tu, H.C. Ong, D.P. Webb, and J.K.L. Lai, IEEE Transactions on Advanced Packaging, Vol. 23, No. 4, pp. 631-636, Nov. 2000.
68	“Comparative study of micro-BGA reliability under bending stress” P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, IEEE Trans Adv Pack Vol 23: (4) pp.750-756 Nov. 2000.
69	“Reliability in modeling of spectroscopic ellisometry”, S.H. Lin, Y.C. Chan, D.P. Webb, and Y.W. Lam, Physica Status Solidi: (A), Vol 182, No.2, Dec. 2000.
70	“Study of microBGA solder joints reliability”, P. L. Tu, Y. C. Chan, K.C. Hung, and J.K.L. Lai, Microelectronics Reliability, Vol.41, Iss 2, pp287-293, Feb 2001.

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