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Peer-reviewed Journal Publications
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71 |
¡§Reliability Studies of mBGA Solder Joints ¡V Effect
of Ni-Sn Intermetallic Compound¡¨, Y.C. Chan, P.L. Tu, C.W. Tang, K.C. Hung,
and J.K.L. Lai, IEEE Transactions on Advanced Packaging, Vol. 24, ISS 1,
pp25-32, Feb. 2001 |
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72 |
¡§Effect of Cooling Rate on the Isothermal Fatigue
Behavior of CBGA Solder Joints in Shear¡¨, S. H. Fan, Y. C. Chan, C. W. Tang,
and J. K. L. Lai, IEEE Transactions on Advanced Packaging, Vol 24, Iss1,
pp10-16, Feb. 2001 |
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73 |
¡§Growth Kinetics of Intermetallic Compounds in Chip
Scale Package Solder Joint¡¨, P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, Scripta
Materialia, Vol 44, Iss2, pp317-323, Feb 2001. |
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74 |
¡§Effect of Intermetallic Compunds on Vibration
Fatigue of mBGA Solder Joint¡¨, P.L. Tu, Y.C. Chan and J.K.L. Lai, IEEE
Transactions on Advanced Packaging, Vol 24 Iss. 2, pp197-205, May 2001. |
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75 |
¡§Nondestructive Methodology for Standoff Height Measurement
of Flip Chip on Flex (FCOF) by SAM¡¨, C.W. Tang, Y.C. Chan, K.C. Hung and D.P.
Webb, IEEE Trans Adv Pack 24(2): pp163-168, May 2001. |
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76 |
¡§The Effect of Metal Oxide on the No-flow Underfill
Fluxing Capacity¡¨, Y.C. Chan, S.H. Fan, and K. C. Hung, Materials Science
and Engineering: B Solid-State Materials for Advanced Technology, B85 (2001)
pp64-69, 4 Aug 2001 |
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77 |
¡§Fatigue Lifetimes of PBGA Solder Joints Reflowed at
Different Conveyor Speeds¡¨, S. H. Fan, Y. C. Chan and J. K. L. Lai, J Electronic
Packaging 123 (3); pp290-294, Sep 2001 |
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78 |
¡§The Effect of Solder Paste Volume and Reflow Ambient
Atmosphere on Reliability of CBGA Assemblies¡¨, Y. P. Wu, P. L. Tu, and Y. C.
Chan, Journal of Electronic Packaging 123(3): pp284-289,
September 2001. |
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79 |
¡§Aging Studies of PBGA Solder Joints Reflowed at
Different Conveyor Speeds¡¨, S.H. Fan, Y. C. Chan, C.W. Tang & J.K.L Lai, IEEE
Transactions on Advanced Packaging, Vol 24, No. 4, November 2001. |
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80 |
¡§Study of the Self-alignment of No-flow Underfill
for Micro-BGA Assembly¡¨, Y. C. Chan, P.L. Tu, and K.C. Hung, Microelectronics
Reliability Vol 41, Issue 11, pp-1867-1875, Nov 2001. |
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81 |
¡§Reliability of MicroBGA Assembly Using No-flow
Underfill¡¨, P.L. Tu, Y. C. Chan & K.C. Hung, Microelectronics
Reliability, Vol 41-12, pp 1993-2000, Dec 2001 |
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82 |
"Development of Gold to Gold Interconnection
Flip Chip Bonding for Chip On Suspension Assemblies", C.F. Luk, Y.
C. Chan and K.C. Hung. Microelectronics Reliability, Vol 42 Number 3, p.p
381-389, Mar 2002. |
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83 |
¡§Application of adhesive bonding techniques in hard
disk drive head assembly¡¨, C.F. Luk, Y. C. Chan, K.C. Hung, Microelectronics
Reliability, Vol 42 (2002), Number 4-5, 767-777, April-May 2002. |
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84 |
¡§Effect of misalignment on electrical
characteristics of ACF joints for flip chip on flex applications¡¨, S.H. Fan
and Y.C. Chan, Microelectronics Reliability, vol. 42 (7),
pp.1081-1090, July 2002. |
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85 |
¡§No-flow underfill flip chip assembly - an
experimental and modeling analysis,¡¨ H. Lu, K. C. Hung, S. Stoyanov, C.
Bailey and Y. C. Chan, Microelectronics Reliability Volume 42, 8,
pp.1205-1212, July 2002. |
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86 |
¡§Reliabilty Study of Electroless Ni-P Layer against
Solder Alloy¡¨, M. O. Alam, Y. C. Chan, and K. C. Hung, Journal of
Microelectronics Reliability., volume 42, Number 7, pp 1065-1073, July 2002. |
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87 |
¡§Effects of Bonding Parameters on the Reliability
Performance of Anisotropic Conductive Adhesive Interconnects for
Flip-Chip-on-Flex (FCOP) Packages Assembly: II-Different Bonding Pressure¡¨,
Y. C. Chan and D.Y. Luk, Microelectronics Reliability, vol 42(8),
pp.1195-1204, August 2002. |
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88 |
¡§Effects of Bonding Parameters on the
Reliability Performance of Anisotropic Conductive Adhesive Interconnects for
Flip-Chip-on-Flex (FCOP) Packages Assembly: I-Different Bonding Temperature¡¨,
Y. C. Chan and D.Y. Luk, Microelectronics Reliability, vol 42(8),
pp.1185-1194, August 2002. |
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89 |
¡§An Investigation of Intermetallics Formation
Between Pd/Ag Metallization and Sn/Pb/Ag Solder¡¨, G.Y. Li, Y. C. Chan, Journal
of Electronic Packaging, Vol. 124, pp. 305-310, September 2002. |
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90 |
¡§Interfacial Reaction of Pb-Sn Solder and Sn-Ag
Solder with Electroless Ni Deposit During Reflow¡¨, M.O. Alam, Y. C. Chan and
K.C. Hung, Journal of Electronic Materials, Vol. 31, No. 10, Pages
1117-1121, October 2002. |
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91 |
¡§Study of Short-Circuiting between Adjacent Joints
under Electric Field Effects in Fine Pitch Anisotropic Conductive Adhesive
Interconnects¡¨, Y.W. Chiu, Y. C. Chan and S.M. Lui, Microelectronics
Reliability, pp1945-1951, Dec. 2002. |
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92 |
¡§Correlation between the Mechanical Strength and
Curing Condition of No-Flow Flip Chip Assemblies¡¨, C.W. Tang, Y. C. Chan,
K.C. Hung and P.L. Tu, , Journal of Electronic Packaging, vol. 128,
pp.397-402, Dec. 2002. |
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93 |
¡§Effect of autocalve test on anisotropic conductive
joints¡¨, C.W. Tan, Y. C. Chan & N.H. Yeung, Journal of
Microelectronics Reliability, Vollume 43, Issue 2, , Pages 279-285. February
2003. |
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94 |
¡§Current Carrying Capacity of ACF Joints for the Flip
Chip on Flex Applications¡¨, S. H. Fan and Y. C. Chan, Journal of
Electronic Materials, Vol.32, Iss. 2, p.101, Feb 2003. |
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95 |
¡§Behaviour of Anistropic Conductive Joints under
Mechanical Loading¡¨, C.W. Tan, Y. C. Chan & NH Yeung., Microelectronics
Reliability.Volume 43, Issue 3, , Pages 481-486, March 2003. |
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96 |
¡§Curing Kinetics of Anisotropic Conductive Adhesive
Film¡¨, Y. C. Chan, M. A. Uddin, M. O. Alam and H. P. Chan, Journal of
Electronic Materials, Vol 32, No. 3, March 2003. |
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97 |
¡§The Effect of Cooling Rate on the Growth of Cu-Sn
Intermetallics in Annealed PBGA Solder Joints¡¨, S. H. Fan, Y. C. Chan and
J.K.L Lai, Journal of Electronic Packaging, vol 125, Issue 1, pp.153-156,
March 2003. |
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98 |
¡§Open defects in PBGA Assembly Solder Joints¡¨, S.H.
Fan Y. C. Chan and J.K.L Lai, Journal of Electronic Packaging, Vol 125,
Issue 1, pp. 157-161, March 2003. |
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