Peer-reviewed Journal Publications

　

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No.	Title	Download
99	“Curing Kinetics of Anisotropic Conductive Adhesive Film”, Y. C. Chan, M. A. Uddin, M. O. Alam and H. P. Chan, Journal of Electronic Materials, Vol 32, No. 3, March 2003.
100	“The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints”, S. H. Fan, Y. C. Chan and J.K.L Lai, Journal of Electronic Packaging, vol 125, Issue 1, pp.153-156, March 2003.
101	“Open defects in PBGA Assembly Solder Joints”, S.H. Fan Y. C. Chan and J.K.L Lai, Journal of Electronic Packaging, Vol 125, Issue 1, pp. 157-161, March 2003.
102	“The Effects of Reflow Process on the Contact Resistance and Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications”, C. Y. Yin, M. O. Alam, Y. C. Chan,  C. Bailey and Hua Lu,  Journal of Microelectronics Reliability,  Vol 43, Issue 4, pp. 625-633,  April 2003.
103	“Corrosion Study of Anisotropic Conductive Joints on Polyimide Flexible Circuits”, C.W. Tan, Y.C. Chan and Y.W. Chiu, Materials Science & Engineering B, Vol. 98(3), pp. 255-264, April 2003.
104	“Research on the Contact Resistance, Reliability and Degradation Mechanisms of Anisotropically Conductive Film Interconnection for Flip-Chip-on-Flex Applications”, J. H. Zhang , Y. C. Chan , Journal of Electronic Materials, Vol 32, No. 4, April 2003.
105	“Contact Resistance and Adhesion Performance of ACF Interconnections to Aluminum Metallization”, J. H.Zhang, Y. C. Chan, M. O. Alam and S. Fu, Microelectronics Reliability, Volume 43, Issue 8, pp.1303-1310, August 2003.
106	“Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad”, M. O. Alam, Y. C. Chan, and K. N. Tu, Journal of Applied Physics, Volume 94, Number 6, pp. 4108-4115, September 2003.
107	“Plasma cleaning of the Flex substrate for Flip chip bonding with anisotropic conductive adhesive film (ACF)”, M. A. Uddin, M. O. Alam, Y.C. Chan and H.P. Chan. Journal of Electronic Materials, Volume 32, Number 10, 1117-1124, October 2003.
108	“Effect of 0.5 wt.% Cu in Sn-3.5%Ag solder on the interfacial reaction with the Au/Ni metallization”, M. O. Alam, Y. C. Chan and K. N. Tu, ACS journal, Chemistry of  Materials, Volume 15, Number 23, pp. 4340-4342, November 2003.
109	“Effect of 0.5 wt.% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization”, M. O. Alam, Y. C. Chan and K. N. Tu, Journal of Applied Physics, Volume 94, Number 12, pp. 7904-7909, December 2003.
110	“Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy”, M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam, Microelectronics Reliability, Volume 43, Number 12, pp. 2031-2037, December 2003.
111	“Electrical conductive characteristics of anisotropic conductive adhesive particles”, G.B. Dou, Y.C. Chan, J. Liu, Journal of Electronic Packaging 125 (4): 609-616, December 2003.
112	“Effect of Bonding Force on the Conducting  Particle with Different Sizes”, N.H. Yeung, Y.C. Chan & C.W. Tan, Journal of Electronic Packaging, Volume 125, Issue 4. pp. 624-629, December 2003.
113	“Structure Property Relationship In High Tension Ceramic Insulator Fired at High Temperature”, Rashed Adnan Islam, Y.C. Chan and M.F. Islam, Journal of Materials Science and Engineering –B, Solid State Materials for Advanced Technology, Volume 106, Issue 2, pp.132-140, January 2004.
114	“Effect of Volume in Interfacial Reaction Between Eutectic Sn-Pb solder and Cu Metallization in Microelectronic Packaging” Ahmed Sharif, Y. C. Chan and Rashed Adnan Islam, Materials Science and Engineering (B): Solid State Materials for Advanced Technology, Volume 106, Number 2, pp. 120-125, January 2004.
115	“Dissolution Kinetics of BGA Sn-Pb and Sn-Ag Solders with Cu Substrates During Reflow” Ahmed Sharif and Y. C. Chan, Materials Science and Engineering (B): Solid State Materials for Advanced Technology, Volume 106, Number 2, pp. 126-131, January 2004.
116	“A Continuous Contact Resistance Monitoring during the Temperature Ramp of Anisotropic Conductive Adhesive Film Joint”, M. A. Uddin, Y.C. Chan, H.P. Chan  and  M. O. Alam, Journal of Electronic Materials, Vol. 33, Iss. 1; p. 14,  January 2004.
117	“Dynamic Strength of Anisotropically Conductive Film (ACF) Bonded Flip Chip on Glass (COG) and Flip Chip on Flex (COF)”, Y. P. Wu, M. O. Alam, Y. C. Chan and B. Y. Wu, Microelectronics Reliability, Volume 44, Issue 2, pp. 295-302. February 2004.
118	“Effect of Spin Coating on the Curing Rate of Epoxy Adhesive for the Fabrication of a Polymer Optical Waveguide”, M.A. Uddin, H.P. Chan, C.K. Chow, Y.C. Chan, Journal of Electronic Materials, Volume 33, Issue 3, pp. 224-228, March 2004.
119	“Thermal Stability Performance of Anisotropic Conductive Film at Different Bonding Temperatures”, S. C. Tan, Y. C. Chan, Y. W. Chiu and C. W. Tan, Microelectronics Reliability, Volume 44, Issue 3, pp. 495-503, March 2004.
120	“Adhesion strength and Contact resistance of Flip Chip On Flex (FCOF) packages - Effect of Curing degree of Anisotropic Conductive Film”, M. A. Uddin, M. O. Alam, Y. C. Chan and H. P. Chan, Microelectronics Reliability, Volume 44, Issue 3, pp. 505-514, March 2004.
121	“Bias-HAST on tape ball grid array (TBGA) test pattern”, N.H. Yeung, Victor Lau, Y.C. Chan, Microelectronics Reliability, Volume 44, Issue 4pp. 595-602, April 2004.
122	“InnovTech - Creativity and innovation learning facility for engineering students at City University of  Hong Kong”, Y.C. Chan, N.H. Yeung & C.W. Tan, International Journal of Engineering Education, Vol. 20(2), pp. 261-266, April 2004.
123	“Delamination Problems of UV-Cured Adhesive Bonded Optical Fiber in V-Groove for Photonic Packaging”, M.A. Uddin, H.P. Chan, K.W. Lam, Y.C. Chan, P.L. Chu, K.C. Hung, T.O. Tsun, IEEE Photonics Technology Letter, Volume: 16, Issue. 4, pp. 1113-1115, April 2004.

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