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Peer-reviewed Journal Publications
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124 |
¡§Investigation on Bondability
and Reliability of UV-Curable Adhesive Joints for Stable Mechanical
Properties in Photonic Device Packaging¡¨, C.W. Tan, Y.C. Chan, H.P. Chan, N.W.
Leung & C.K. So, Microelectronics Reliability, Vol. 44(5), pp 823-831,
May 2004. |
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125 |
¡§Elimination of Au-embrittlement
in solder joints on Au/Ni metallization¡¨, M. O. Alam, Y. C. Chan and K. N. Tu, Journal of Materials Research, Volume 19m Number
5, pp. 1303-1306, May 2004. |
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126 |
¡§Effect of Microwave Preheating on the Bonding
Performance of Flip Chip on Flex Joint¡¨ Rashed Adnan
Islam and Y.C. Chan, Microelectronics Reliability, Volume 44, Issue 5, pp. 815-821, May 2004. |
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127 |
¡§Effect of Drop Impact Energy on Contact
Resistance of Anisotropic Conductive Adhesive Film Joints¡¨, Rashed Adnan Islam, Y.C. Chan,
B. Ralph, Journal of Materials Research, Volume 19, Number 6, pp.
1662-1668, June 2004. |
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128 |
¡§Characterization of Kovar-to-Kovar Laser Welded Joints and Its Mechanical Strength¡¨,
C.W. Tan, Y.C. Chan, Bernard N.W. Leung, John Tsun
and Alex C.K. So, Optics and Lasers in Engineering, Vol.: 43(2) pp.
151-162, 2004. |
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129 |
¡§Interfacial reactions of Sn-Cu
and Sn-Pb-Ag solder with
Au/Ni during extended time reflow in ball grid array packages¡¨, Islam
MN, Chan YC, Sharif A., Journal of Materials Research 19
(10): 2897-2904 Oct 2004. |
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130 |
¡§Effects of Solder Reflow on the Reliability of Flip
Chip on Flex Interconnections using Anisotropic Conductive Adhesives¡¨
C.Y. Yin, H. Lu, C. Bailey, Y.C. Chan, accepted for publication in the IEEE
Trans on Electronics Packaging Manufacturing, 27 (4): 254-259 OCT 2004. |
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131 |
¡§Interfacial reactions of BGA Sn¡V3.5%Ag¡V0.5%Cu and
Sn¡V3.5%Ag solders during high-temperature aging with Ni/Au metallization¡¨,
Ahmed Sharif, M.N. Islam and Y.C. Chan, Materials Science and Engineering
(B): Solid State Materials for Advanced Technology, Volume 113, Number 3,
Nov. 2004, pp. 184. |
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132 |
¡§Effect of underfill entrapment
on the reliability of flip-chip solder joint¡¨, Y. C. Chan, M. O. Alam, K.C.
Hung, H. Lu and C. Bailey, ASME Journal of Electronic Packaging, Volume
126, Issue 4, December 2004, pp. 541-545. |
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133 |
¡§Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on
Cu Pads During Reflow Soldering¡¨, Ahmed Sharif and Y. C. Chan, Journal of
Electronic Materials, 34 (1): 46-52 JAN 2005 |
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134 |
¡§Investigation of Conductive Adhesive Bonding Using UV
Curable ACAs at Different Curing Conditions¡¨, K.K. Lee, S.C. Tan, Y.C. Chan, Journal
of Electronic Packaging. 127 (1): 52-58 MAR 2005 |
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135 |
¡§Effect of Bump Characteristics and Temperature
Variation on the Online Contact Resistance of Anisotropic Conductive Joints¡¨,
Lafir Ali, Y.C. Chan, M.O. Alam, Journal of Electronic Materials, Vol. 33,
Issue 9, pp. 1028-1035, September 2004. |
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136 |
¡§Dissolution of Electroless Ni Metallization by
Lead-Free Solder Alloys¡¨, Ahmed Sharif, Y.C. Chan, M.N. Islam and M.J. Rizvi, Journal of Alloys and Compounds, 388 (1): 75-82
FEB 8 2005 |
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137 |
¡§Effect of volume in interfacial reaction between
eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic
packaging¡¨, Islam MN, Sharif A, Chan YC, Journal of Electronic
Materials, 34 (2): 143-149 FEB 2005 |
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138 |
¡§Interfacial Reactions with or without Cu in
Sn-3.5%Ag Solder with Electroless Ni/Au Metallization During Multiple Reflow
Cycles¡¨ Ahmed Sharif and Y. C. Chan, Journal of Materials Science:
Materials in Electronics, 16 (3): 153-158 MAR 2005 |
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139 |
¡§Effect of indium addition in Sn-rich
solder on the dissolution of Cu metallization¡¨, Ahmed Sharif, Y.C. Chan, Journal
of Alloys and Compounds. 390 (1-2): 67-73 MAR 22 2005 |
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140 |
¡§Study of Anisotropic Conductive Adhesive Joint
Behavior under 3-Point Bending¡¨, M. J. Rizvi, Y. C.
Chan, C. Bailey & H. Lu, Microelectronics Reliability, 45 (3-4):
589-596 MAR-APR 2005. |
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141 |
¡§Interfacial reaction phenomena of Sn-Pb solder with Au/Ni/Cu metallization¡¨, M. O. Alam and
Y. C. Chan, ACS journal, Chemistry of Materials, volume 17, issue 5, March
2005, pp 927 ¡V 930. |
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142 |
¡§Investigation on Micro-hardness of Sn-Zn Based Lead-Free Solder Alloys as Replacement of Sn-Pb Solder¡¨, R. A. Islam, B. Y. Wu, M. O. Alam, Y. C.
Chan, W. Jillek , Journal of Alloys and
Compounds, 392 (1-2): 149-158 APR 19 2005 |
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143 |
¡§Electric current effect on microstructure of ball
grid array solder joint¡¨, B. Y. Wu , Y.C. Chan, Journal
of Alloys and Compounds, 392 (1-2): 237-246 APR 19 2005. |
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144 |
¡§Modelling the effect of
voids in anisotropic conductive adhesive joints¡¨, Lee KK, Yeung NH, Chan
YC, Soldering & Surface Mount Technology, 17 (1): 4-12 2005 |
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145 |
¡§Interfacial Reactions on Electrolytic Ni and
Electroless Ni(P) metallization with Sn-In-Ag-Cu
solder¡¨ Ahmed Sharif and Y. C. Chan, Journal of Alloys and Compounds. 393
(1-2): 135-140 MAY 3 2005 |
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146 |
¡§Interfacial reactions of Cu-containing lead-free
solders with Au/NiP metallization¡¨, Islam MN,
Chan YC, Journal of Electronic Materials, 34 (5): 662-669 MAY 2005 |
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147 |
¡§Effect of 0.5 wt% Cu in Sn-3.5%Ag
solder ball on the solid state interfacial reaction with the Au/Ni/Cu bond
pad for Ball Grid Array(BGA) application¡¨, M. O. Alam, Y. C. Chan, K. N. Tu and J. K. Kivilahti, in the ACS
journal, Chemistry of Materials, Vol. 17, No. 9, May 2005, pp. 2223-2226. |
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