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Peer-reviewed Journal Publications
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No. |
Title |
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148 |
¡§Effect of 9 wt.% in
addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads¡¨. Islam MN, Chan YC,
Sharif A, Rizvi MJ, Journal of Alloys and
Compounds, 396 (1-2): 217-223 JUN 21 2005 |
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149 |
¡§Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder
with Cu and Ni substrates¡¨, Rizvi MJ, Chan YC,
Bailey C, H. Lu and Islam MN, Journal of Electronic Materials, 34 (8):
1115-1122 AUG 2005 |
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150 |
¡§Effect of thermal cycling on the online contact
resistance of anisotropic conductive joints¡¨, Lafir Ali, Y. C. Chan, and M.
O. Alam, Soldering and Surface Mounting Technology, 17 (3): 20-31 2005 |
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151 |
¡§The effect of curing on the performance of ACF bonded
chip-on-flex assemblies after thermal ageing¡¨, M. F. Rizvi,
Y. C. Chan, C. Bailey, H. Lu and A. Sharif, Soldering and Surface Mounting
Technology, 17 (2): 40 - 48 2005 |
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152 |
¡§Interfacial reactions of Sn¡VCu
solder with Ni/Au surface finish on Cu pad during reflow and aging in ball
grid array packages¡¨, M.N. Islam and Y.C. Chan, Materials
Science and Engineering B, Volume 117, Issue 3, |
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153 |
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154 |
¡§Process
optimization to overcome void formation in nonconductive paste
interconnections for fine-pitch applications¡¨, Tan SC, Chan YC, Lui NSM, Journal Of Electronic Materials 34 (8):
1143-1149 AUG 2005 |
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155 |
¡§Moisture
effects on the reliability of ACF interconnections¡¨, Yin CY, Lu H,
Bailey C, Chan YC , Electronics World 111 (1836): 20-24 DEC 2005 |
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156 |
"Comparative study of the dissolution kinetics of
electrolytic Ni and electroless NiP layers by
molten Sn3.5Ag solder alloy", Islam MN, Chan YC, Alam
MO, Journal Of Electronic Packaging, 127 (4): 365-369 DEC 2005. |
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157 |
"Behavior of anisotropic conductive film (ACF) joint
under mechanical shock", Islam
RA, Chan YC, Journal Of Electronic Packaging 127 (4): 375-380 DEC 2005 |
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158 |
¡§Effect of adding 1wt% Bi into the Sn-2.8Ag-0.5Cu
solder alloy on the intermetallic formations with Cu-substrate during
soldering and isothermal aging¡¨, M.J. Rizvi, Y.C.
Chan, C. Bailey, H. Lu and M.N. Islam, Journal of Alloys and Compounds,
Volume 407, Issues 1-2, pp.208-214, 5 Jan2006 |
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159 |
¡§Electrochemical Corrosion Study of Pb-Free Solders¡¨, B. Y. Wu, Y. C. Chan, |
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160 |
¡§Liquid and solid state interfacial reactions of Sn-Ag-Cu and Sn-In-Ag-Cu
solders with Ni-P under bump metallization¡¨, Ahmed Sharif, Y.C Chan., Thin
Solid Films 504 (2006) pp. 431-435 |
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161 |
¡§High electric current density-induced interfacial
reactions in micro ball grid array (£gBGA) solder
joints¡¨, M.O. Alam, B.Y. Wu, Y.C. Chan and K.N. Tu,
Acta Materialia,
Volume 54, Issue 3, Pages 613-621, Feb 2006 |
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162 |
¡§RLC Effects in Fine Pitch Anisotropic
Conductive Film Connections¡¨, Dou G.B., Chan Y.C., Morris J.E. and Whalley D.C., Soldering & Surface Mount
Technology, 18(1), 2006, pp. 3-10 |
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163 |
¡§Effect of multiple reflow processes on the
reliability of ball grid array (BGA) solder joints¡¨, W.H. Zhong,
Y.C. Chan, M.O. Alam, B.Y. Wu, J.F. Guan, Journal of Alloys and Compounds
414 (2006) 123-130 |
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164 |
¡§Macro-micro modelling of moisture
induced stresses in an ACF flip chip assembly¡¨, C.Y. Yin, H. Lu, C. Bailey,
Y.C. Chan, Soldering & Surface Mount Technology, Vol
18 (2), pp. 27-32, 2006 |
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165 |
"A study of the assembly process and reliability
performance of contactless smart cards fabricated using a non-conductive
adhesive film", Ma Y, Chan YC,
Journal Of Adhesion Science And Technology 20 (2-3): 245-259 2006. |
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166 |
"Microwave preheating of anisotropic conductive adhesive
films for high-speed flip chip on flex bonding", Islam RA, Chan YC, Journal Of Electronic
Materials, 35 (1): 123-131 JAN 2006. |
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167 |
"Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove
for photonic packaging", Uddin MA, Chan
HP, Tsun TO, Chan YC , Journal Of Lightwave Technology, 24 (3): 1342-1349 MAR 2006. |
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168 |
"Effect of solder filler thickness on the
mechanical stability of fiber-solder-ferrule joint under temperature cyclic
loading", Tan CW, Chan YC, Yeung NH, Journal of Materials
Science-Materials In Electronics 17 (4): 325-333 APR 2006. |
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169 |
¡§Processability and
Reliability of Nonconductive Adhesives (NCAs) n Fine-Pitch Chip-on-Flex
Applicants¡¨, W.K. Chian, Y.C. Chan, Brian Ralph,
Andrew Holland, Journal of Electronic Materials; Mar 2006; 35, 3; ProQuest Science Journals, p. 443 |
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170 |
¡§Uneven Curing Induced Interfacial Delamination of UV Adhesive-Bonded Fiber Array in V-Groove
for Photonic Packing¡¨, M.A. Uddin, Hau Ping Chan, T. O. Tsun and
Y. C. Chan, Journal of Lightwave Technology, Vol 24, No. 3, pp.1342-1349, March 2006 |
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171 |
¡§The Effect of Different Bonding Temperatures on the
Mechanical and Electrical Performance of NCF-Bonded Flip-Chip-on-Flex
Packages¡¨, S.C. Tan, Y. C. Chan, N. S. M. Lui, IEEE
Transactions on Advanced Packaging, Vol 29, No. 3,
Aug 2006 |
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