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Peer-reviewed Journal Publications
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No. |
Title |
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172 |
¡§Electrical Characterization of NCP- and NCF-Bonded
Fine-Pitch Flip-Chip-on-Flexible Packages¡¨, Y.C. Chan, S.C. Tan, Nelson S.M.
Lui, and C.W. Tan, IEEE Transactions on Advanced Packaging, Vol. 29, No.
4, Nov 2006 |
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173 |
¡§Reliability of BGA Solder Joints on the Au/Ni/Cu
Bond Pad-Effect of Thicknesses of Au and Ni Layer¡¨, M. O. Alam, B. Y. Wu, Y.
C. Chan and Libor Rufer, IEEE Transactions on Device and Materials
Reliability, Vol. 6, No. 3, pp. 421-428, Sept 2006 |
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174 |
¡§Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder
joints between Au/Ni (P)/Cu pads stressed with moderate current density¡¨,
B.Y. Wu, H.W. Zhong, Y.C. Chan, M.O. Alam, J Master Science: Mater
Electron (2006) 17: 943-950 |
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175 |
¡§Reliability of anisotropic conductive joints for
bumpless flip-chip on flex packages under thermal stresses¡¨, Lafir Ali, Y.C.
Chan, M.O. Alam, JMEP (2005) , Vol 2, No4 |
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176 |
¡§Multiple reflow study of ball grid array (BGA)
solder joints on Au/Ni metallization¡¨, W. H. Zhong, Y. C. Chan, B. Y. Wu, M.
O. Alam, J. F. Guan, Journal of Materials Science (2006) |
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177 |
¡§Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch
Flip-Chip-on-Flexible Packages¡¨, Y. C. Chan, S. C. Tan, N. S. M. Lui and C.
W. Tan, IEEE Transactions on Advanced Packaging (2007) Vol 30, No. 1 |
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178 |
¡§Investigation of interfacial reactions between
Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization¡¨, A.
Sharif, Y.C. Chan, Journal of Alloys and Compounds (2006) Vol 440, Issue
1-2, page 117-121 |
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179 |
¡§Effect of current stressing on the reliability of
63Sn37Pb solder joints¡¨, B. Y. Wu, Y. C. Chan, H. W. Zhong, M. O Alam, Journal
of Material Science (2007) 42:7415-7422 |
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180 |
¡§Microstructural evolution and atomic transport by thermomigration
in eutectic tin-lead flip chip solder joints¡¨ ,D. Yang, B. Y. Wu, Y. C. Chan,
and K. N. Tu, Journal of Applied Physics, 102, 2007, 043502. |
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181 |
¡§Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard
Interfacial Reactions with the Electroless Ni-P Metallization for BGA Solder
Joints Application¡¨, MO Alam, Y. C. Chan, IEEE Transactions on Advanced
Packaging, (2008) Vol. 31, No. 2 pp. 431-438 |
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182 |
¡§Mechanical Behavior and Low-Cycle shear Fatigue
Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging¡¨, C. W.
Tan, Y. C. Chan, N. W. Leung and H. D. Liu, IEEE Transactions on Advanced Packaging,
(2008) Vol. 31, No. 2 pp. 386-393 |
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183 |
¡§The time-dependent melting failure in flip chip
lead-free solder interconnects under current stressing¡¨, D. Yang, Y. C. Chan,
K. N. Tu, Applied Physics Letter, 93 (2008) 041907 |
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184 |
¡§Growth mechanism of bulk Ag3Sn
intermetallic compounds in Sn-Ag solder during solidification¡¨, J. Shen, Y.
C. Chan, S. Y. Liu, Intermetallics, 16 (2008) 1142-1148 |
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185 |
¡§Electromigration in Line-Type Cu/Sn-Bi/Cu Solder
Joints¡¨, X. Gu and Y.C. Chan, Journal of Electronic Materials, 37(11), Pages
1721-1726 (Aug 2008). |
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186 |
¡§Electromigration and thermomigration behavior of
flip chip solder joints in high current density packages¡¨,D. Yang, Y. C.
Chan, B. Y. Wu, and M. Pecht, Journal of Materials Research, 23(9),
2333 (2008) |
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187 |
¡§Effects
of Electromigration on the Growth of Intermetallic Compounds in Cu/SnBi/Cu
Solder Joint¡¨, X. Gu, D. Yang, Y.C. Chan, B.Y. Wu, Journal of Materials
Research, 23(10), Pages 2591-2596 (Oct 2008) |
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188 |
¡§Assessment of toxicity potential of metallic
elements in discarded electronics: a case study of mobile phones in
China¡¨, B.Y. Wu, Y.C. Chan, A.
Middendorf, X. Gu, H.W. Zhong, Journal of Environmental Sciences (Beijing,
China), 20(11), Pages 1403-1408 (Nov 2008) |
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