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Peer-reviewed Journal Publications
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No. |
Title |
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189 |
ˇ§The shearing behavior and microstructure of
Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes
composite coatingˇ¨, X. Gu, Y. C. Chan, D. Yang, B.
Y. Wu, Journal of Alloys and Compound, 468(1-2), Pages 553-557 (Jan 2009). |
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190 |
ˇ§Research advances in nano-composite soldersˇ¨, J. Shen and Y.C. Chan, Microelectronic Reliability, 49,
Pages 223ˇV234 (Mar 2009). |
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191 |
ˇ§Finite-Element Simulation of Stress Intensity
Factors in Solder Joint Intermetallic Compoundsˇ¨, M.O. Alam, H. Lu, C. Bailey, and Y.C. Chan, IEEE
Transactions on Device and Materials Reliability, 9(1), Pages 40-48 (Mar
2009) |
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192 |
ˇ§The determination of hexavalent
chromium (Cr6+) in electronic and electrical components and products to
comply with RoHS regulationsˇ¨, L. Hua, Y.C. Chan,
Y.P. Wu, B.Y. Wu, Journal of Hazardous Materials, 163(2-3), Pages 1360-1368
(Apr 2009) |
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193 |
ˇ§Fracture mechanics analysis of Solder Joint
Intermetallic Compounds in shear testˇ¨, M.O. Alam, H. Lu, C. Bailey, and Y.C. Chan,
Computational Materials Science, 45(2), Pages 576-583 (Apr 2009) |
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194 |
ˇ§Effect of metal/ceramic nanoparticle-doped fluxes
on the wettability between SnˇVAgˇVCu
solder and a Cu layerˇ¨, J. Shen, and Y.C. Chan,
Journal of Alloys and Compounds, 477(1-2), Pages 909-914 (May 2009) |
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195 |
ˇ§Effects of ZrO2 nanoparticles on the mechanical
properties of SnˇVZn solder joints on Au/Ni/Cu padsˇ¨
J. Shen, and Y.C. Chan, Journal of Alloys and
Compounds, 477(1-2), Pages 552-559 (May 2009) |
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196 |
ˇ§Thermomigration and electromigration
in Sn58Bi solder jointsˇ¨, Xin Gu
and Y.C. Chan, Journal of Applied Physics, 105, Pages 093537[1-5] (May 2009) |
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197 |
ˇ§Effect of nano Ni additions on the structure and
properties of SnˇV9Zn and SnˇVZnˇV3Bi solders in Au/Ni/Cu ball grid array
packagesˇ¨, Asit Kumar Gain, Y.C. Chan and Winco
K.C. Yung, Materials Science and Engineering: B, 162(2), Pages 92-98 (June
2009) |
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198 |
ˇ§Influence of Small Amount of Al and Cu on the
Microstructure, Microhardness and Tensile Properties of Sn-9Zn Binary
Eutectic Solder Alloyˇ¨, S.K. Das, A. Sharif, Y.C. Chan, N.B. Wong, Winco K.C. Yung, Journal of Alloys and Compounds,
481(1-2), Pages 162-172 (July 2009) |
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199 |
ˇ§Interfacial microstructure and shear strength of Ag
nano particle doped SnˇV9Zn solder in ball grid array packagesˇ¨, Asit Kumar
Gain, Y.C. Chan, Ahmed Sharif, N.B. Wong, Winco
K.C. Yung, Microelectronics Reliability, 49, Pages 223ˇV234 (July 2009) |
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200 |
ˇ§Effect of Ag Micro Particles Content on the
Mechanical Strength of the Interface Formed between Sn-Zn
Binary Solder and Au/Ni/Cu Bond Padsˇ¨, S.K. Das, A. Sharif, Y.C. Chan, N.B
Wong, Winco K.C. Yung, Microelectronic Engineering,
86(10), Pages 2086-2093 (July 2009) |
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201 |
ˇ§Growth mechanism of Ni3Sn4 in a Sn/Ni
liquid/solid interfacial reactionˇ¨, J. Shen, Y.C.
Chan, S.Y. Liu, Acta Materialia,
57(17), Pages 5196-5206 (Oct 2009) |
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202 |
ˇ§Effect of small SnˇV3.5AgˇV0.5Cu additions on the
structure and properties of SnˇV9Zn solder in ball grid array packagesˇ¨, Asit
Kumar Gain, Y.C. Chan, Ahmed Sharif, Winco K.C.
Yung, Microelectronic Engineering, 86(11), Pages 2347-2353 (Nov 2009) |
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