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Prof. TU King Ning (杜經寧)

PhD Harvard University (USA), B.S National Taiwan University (Taiwan)

Chair Professor of Department of Materials Science and Engineering

Chair Professor of Department of Electrical Engineering

Photo of Prof Tu

Contact Information

Office: AEB-008
Phone: +(852)-3442-2740
Fax: +(852)-3442-0892
Email: kntu@cityu.edu.hk

Research Expertise

  • Thin Film Materials Science
  • Kinetics in Nanoscale Materials
  • Reliability Science in Microelectronic Devices

Professor TU King-Ning is the Chair Professor of Materials and Electrical Engineering of the City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1968. Professor Tu has been the TSMC Chair Professor and E. Sun Scholar of National Chiao Tung University, Taiwan. Professor Tu is a world leader in the science of thin films, especially in its applications in microelectronic devices, packaging and reliability. His recent work is on predicting failure in modern microelectronics based on entropy production.

Professional Experience

    04/19 – 03/22 E. Sun Scholar at National Chiao Tung University, sponsored by Ministry of Education, Taiwan
    07/16 – Now TSMC Chair Professor, National Chiao Tung Uni., Hsinchu, Taiwan
    07/98 – 06/04 Chair, Dept. of Materials Science & Engineering, UCLA
    07/93 – 06/16 Professor, Dept. of Materials Science & Engineering and Dept. of Electrical Engineering, UCLA
    09/02 – 10/02 Tan Kah Kee visiting professorship in School of Materials Engineering, Nanyang Technology University, Singapore
    07/88 – 06/93 Adjunct Professor, Dept. of Materials Science, Cornell University, Ithaca
    12/68 – 06/93 IBM T.J. Watson Research Center, Yorktown Heights, New York
    09/85 – 10/87: 3rd Level Manager of Materials Science Department
    09/78 – 08/85: 2nd Level Manager of Thin Film Science Department
    09/72 – 08/78: 1st Level manager of Kinetics and Diffusion Group


  • IEEE Division of Components, Packaging, and Manufacturing Technology Award in 2017
  • Materials Research Society - Fellow 2014
  • TMS John Bardeen Award in 2011
  • TMS-EMPM Division Distinguished Scientist/Engineer Award in 2006
  • Member of Academia Sinica, ROC, 2002
  • Humboldt Research Award for Senior US scientists, 1996
  • Acta/Scripta Metallurgical Lecturer, 1990 - 1992
  • Churchill College - Overseas Fellow, 1990
  • The Metallurgical Society - Fellow, 1988
  • Materials Research Society - President, 1981
  • The Metallurgical Society - Application to Practice Award, 1981
  • American Physical Society - Fellow, 1981

Research Experience

    Thin Film Materials Science, Kinetics in Nanoscale Materials, and Reliability Science in Microelectronic Devices



  • Authored a reference book on “Understanding the reliability technology based on entropy production, and other researches” to be published by Index of Science, UK, in June, 2021.
  • Co-authored with Prof. Hung-Ming Chen and Prof. Chih Chen a textbook on “Electronic Packaging Science and Engineering” to be published by Wiley in June, 2021.
  • Published a reference book on “Solder Joint Technology” by Spring in 2007.
  • Co-authored with Prof. A. M. Gusak a textbook on “Kinetics in Nanoscale Materials”, published by Wiley in 2014.
  • Published a textbook on “Electronic Thin Film Reliability” by Cambridge University Press in 2011, which has been translated into Korean in 2016 (ISBN 978-89-6421-277-6)
  • Co-authored with J. W. Mayer and L. C. Feldman a textbook on “Electronic Thin Film Science,” published by Macmillan in 1992.

Selected Journal
(Over 500 journal publications with a total citation over 28000, and h-index of 89 (Web-Google))

  • K. N. Tu and D. Turnbull, "Morphology of Cellular Precipitation of Tin from Lead-Tin Bicrystals - II," Acta Met. 15, 1317 (1967).
  • J. W. Mayer, J. M. Poate, and K. N. Tu, “Thin film and solid-phase reactions,” Science, vol. 180, 228-234 (1975).
  • K. N. Tu and J. W. Mayer, "Silicide Formation," Chapter 10 in Thin Films - Inter-diffusion and Reactions, edited by J.M. Poate, K.N. Tu and J.W. Mayer, John Wiley (1978).
  • U. Gosele and K. N. Tu, "Growth Kinetics of Planar Binary Diffusion couples: Thin Film Case versus Bulk Cases," J. Appl. Phys. 53, 3252 (1982).
  • K. N. Tu, "Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin film reactions," Phys. Rev. B49, 2030-2034 (1994).
  • K. N. Tu, "Recent advances on electromigration in very-large-scale-integration of interconnects," J. Appl. Phys., 94, 5451-5473 (2003). (Applied Physics Review)
  • Kuen-Chia Chen, Wen-Wei Wu, Chien-Neng Liao, L. J. Chen, and K. N. Tu, “Observation of atomic diffusion at twin-modified grain boundaries in Copper,” Science, vol. 231, 1066-1069 (2008).
  • H. Y. Hsiao, C. M. Liu, H. W. Lin, T. C. Liu, C. L. Lu, Y. S. Huang, C. Chen, K. N. Tu, “Unidirectional growth of microbumps on (111) oriented nano-twin copper,” Science, vol. 336, 1007 (2012).
  • K. N. Tu, Yingxia Liu, and Menglu Li, “Effect of Joule heating and current crowding on electromigration in mobile technology,” Applied Physics Reviews, 4, 011101 (2017).
  • K. N. Tu and A. M. Gusak “A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production,” J. of Appl. Phys., 126, 075109 (2019).