Keynote Speeches


Terahertz Electronics and Performance Enhancement towards the Post-Moore Era
by
Hideyuki Nosaka
NTT Device Technology Laboratories,
NTT Corporation

Abstract:
Millimeter-wave and terahertz bands are expected to be used for ultra-high-speed wireless and optical transmission, sensing, imaging, and other high frequency applications because of their light-like broad band and penetration ability. This talk introduces 300-GHz-band wireless communication ICs in InP HEMT technology and over 100-Gbit/s optical communication ICs in InP HBT technology. The talk will conclude with a presentation of a new performance enhancement approach combining silicon CMOS LSIs and high-speed compound semiconductor ICs for the post-Moore era.


Biography:
Hideyuki Nosaka received the B.S. and M.S. degrees in physics from Keio University, Yokohama, Japan, in 1993 and 1995, respectively, and the Dr. Eng. degree in electronics and electrical engineering from the Tokyo Institute of Technology, Tokyo, Japan, in 2003.

In 1995, he joined NTT Wireless System Laboratories, Kanagawa, Japan, where he was engaged in research and development of direct digital frequency synthesizers (DDFS). Since 1999, he has been engaged in research and development of mixed-signal ICs for 10-to-400-Gb/s optical communications systems at NTT Photonics Laboratories, Kanagawa Japan. He is currently a senior research engineer, supervisor, and group leader of the High-Speed Analog Circuit Research Group at NTT Device Technology Laboratories, Kanagawa, Japan.

Dr. Nosaka is a member of the IEEE Microwave Theory and Techniques Society (MTT-S), the IEEE Solid-State Circuits Society (SSCS), and the Institute of Electronics, Information and Communication Engineers (IEICE) of Japan. He served as chair of the High-speed Digital, Mixed Signal, and Optoelectronics ICs subcommittee of the IEEE Compound Semiconductor Integrated Circuits Symposium (CSICS). He is also a member of the IEEE MTT-S Technical Committee Digital Signal Processing (MTT-9) and the International Technical Program Committee of the IEEE International Solid-State Circuits Conference (ISSCC).