A collaboration of
City University of Hong Kong
C & L Holdings Ltd
and Elec & Eltek Multilayer PCB Ltd
The project is supported by Innovation and Technology Fund (ITF), HKSAR [Project No. ITS/049/11FP].

Unique features

• Standard Lithography and PCB technology processing
• Optical Fiber or Waveguide as the transmission channel
• High transmittance @ 850 nm
• High heat and pressure resistance
• 12 Channels for 10Gb/s, total 120Gb/s

Technical data

Substrate Standard	FR4 (5x5 inch)
Lamination	Standard temperature > 180 °C, pressure 23 kp/sq. cm
Standard tests Reflow	3 times for 10 s solder floating at 260 °C
Optical loss	~0.12 dB @Central wavelength = 850 nm (Fiber) ~0.45 dB/cm @Central wavelength = 850 nm (Waveguide, Photolithography technique) ~0.4 dB/cm @Central wavelengthl = 850 nm (Waveguide, Imprinting Technique)

Fiber PCB Cross Section

 

Waveguide PCB Cross Section

 

10Gb/s Eye Diagram

 

Fibre PCB Top View

 

Waveguide PCB Top View