New PCB resonator structures for HP, HF and HE operation
Research papers
- 01
K. Li, J. Wu, S. C. Tan, K. W. E. Cheng and S.-Y. R. Hui, “Characterization and Modeling of Dual-Single-Layer PCB Resonators for Megahertz Hybrid Inductive and Capacitive Wireless Power Transfer,” IEEE Transactions on Power Electronics, vol. 40, no. 10, pp. 16004–16021, Oct. 2025.
DOI - 02
K. Li, J. Wu, S. C. Tan and S. Y. R. Hui, “Design and Modelling of a Mega-Hertz PCB Resonator with Hybrid Inductive and Capacitive Wireless Power Transfer Capability,” 2024 IEEE Energy Conversion Congress and Exposition (ECCE), Phoenix, AZ, USA, pp. 7100–7104.
DOI - 03
Y. Wang, K. Wang, K. Li, Y. Yang and S. Y. R. Hui, “Multi-MHz Inductive and Capacitive Power Transfer Systems With PCB-Based Self-Resonators,” IEEE Transactions on Power Electronics, vol. 39, no. 10, pp. 14077–14090, Oct. 2024.
DOI - 04
J. Wu, K. Li, S. C. Tan and S. Y. R. Hui, “High-Frequency PCB Resonator Designs With Quality Factor Exceeding 1000,” 2024 IEEE Energy Conversion Congress and Exposition (ECCE), Phoenix, AZ, USA, pp. 6939–6943.
DOI - 05
Y. Wang, K. Wang, K. Li, Y. Yang and S. Y. R. Hui, “Self-Resonant Capacitive Power Transfer System Leveraging Printed-Circuit-Board Coupler with Integrated Compensation Inductance,” 2024 IEEE Energy Conversion Congress and Exposition (ECCE), Phoenix, AZ, USA, pp. 2425–2429.
DOI