PhD student, Mr HU Xiao, has recently received the JCAP Outstanding Paper Award in the 15th International Conference on Electronic Packaging Technology (ICEPT 2014). The winning paper, supervised by Prof Y C Chan, is called “Electroless Ni-P-Zr02 Metallization for Lead-free Solder Interconnection”.
ICEPT 2014 was held in Chengdu this year. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.