Internship Vacancies:

• Winter InnoTalent Programme 2022 by Hong Kong Productivity Council
• Summer Placement Prograqmme 2022 by the Hong Kong Observatory
• “(Intern) Firmware Engineer (Performance Modeling & Analysis)” from Huawei Hong Kong Research Center
• “(Intern) Digital Design & Verification Engineer” from Huawei Hong Kong Research Center
• “Software Engineer Programme” from Hong Kong Exchanges and Clearing Limited (HKEX)
• “2022 HK Student Work Placement” from The Hongkong and Shanghai Banking Corporation Limited (HSBC)    
• “Internship Programs at CCBA” from China Construction Bank (Asia)
• Hang Seng Fintech Internship Programme
• Internship Programme for Non-ethnic Chinese Students 2022 by the HKSAR Government
• “Software Engineer Programme” from Hong Kong Exchanges and Clearing Limited (HKEX)
• “Summer Internship Program ” from Esquel Group  
• “UAiTED 2022 International Virtual Internship Program” from Oppstar Technology Malaysia
• Fintech Career Accelerator Scheme (FCAS) 2023 by Hong Kong Monetary Authority (HKMA)
• Summer Internship (Operating Excellence and Digital Innovation) by The Hongkong and Shanghai Banking Corporation Limited (HSBC)
• Summer Internship (Wealth & Personal Banking, Operating Excellence and Digital Innovation) by The Hongkong and Shanghai Banking